Findings in the Area of Technology Reported from Federal Reserve Bank (Who Collaborates With the Soviets? Financial Distress and Technology Transfer During the Great Depression): Technology

2025 FEB 27 (NewsRx) -- By a News Reporter-Staff News Editor at Engineering Daily News -- New research on Technology is the subject of a report. According to news reporting originating from New York City, New York, by NewsRx correspondents, research stated, “We provide evidence that financial distress induces firms to sell their technology to foreign competitors.”

Our news editors obtained a quote from the research from Federal Reserve Bank, “To do so, we construct a novel, spatial panel dataset by individually researching and locating U.S. firms who signed Technology Transfer Agreements (TTAs) with the Soviet Union during the 1920s and 1930s in various U.S. counties. By relating the number of TTAs signed in each county to the number of bank failures, we establish a significant, positive relationship between financial distress and the number of firms signing TTAs with the Soviet Union.”

According to the news editors, the research concluded: “Our findings suggest that banking panics may create opportunities for foreign countries to acquire affected firms’ technology.”

This research has been peer-reviewed.

For more information on this research see: Who Collaborates With the Soviets? Financial Distress and Technology Transfer During the Great Depression. Explorations In Economic History, 2025;95. Explorations In Economic History can be contacted at: Academic Press Inc Elsevier Science, 525 B St, Ste 1900, San Diego, CA 92101-4495, USA. (Elsevier - www.elsevier.com; Explorations In Economic History - http://www.journals.elsevier.com/explorations-in-economic-history/)

The news editors report that additional information may be obtained by contacting Jacob P. Weber, Federal Reserve Bank, Dept. of Research, 33 Liberty St, New York, NY 10045, United States.

The direct object identifier (DOI) for that additional information is: https://doi.org/10.1016/j.eeh.2024.101637. This DOI is a link to an online electronic document that is either free or for purchase, and can be your direct source for a journal article and its citation.

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